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KAKEN_24246029seika.pdf
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電気粘着効果を発現する機能性表面の開発と極限環境保持機構への応用
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| Kana |
デンキ ネンチャク コウカ オ ハツゲンスル キノウセイ ヒョウメン ノ カイハツ ト キョクゲン カンキョウ ホジ キコウ エノ オウヨウ
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Denki nenchaku koka o hatsugensuru kinosei hyomen no kaihatsu to kyokugen kankyo hoji kiko eno oyo
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Development of functional surface with electro-adhesive effect and the application to fixture element in vacuum and high-temperature environment
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青山, 藤詞郎
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アオヤマ, トウジロウ
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Aoyama, Tojiro
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慶應義塾大学・理工学部・教授
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Research team head
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科研費研究者番号 : 70129302
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柿沼, 康弘
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カキヌマ, ヤスヒロ
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Kakinuma, Yasuhiro
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慶應義塾大学・理工学部・准教授
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Research team member
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科研費研究者番号 : 70407146
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2016
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科学研究費補助金研究成果報告書
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2015
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| Abstract |
半導体製造プロセスにおける真空・高温環境下のウェハ保持のための高速着脱可能な固定機構の実現を目的として, 微細構造を応用した電気粘着表面の開発を試みた。三次元マイクロメッシュ構造にエラストマを含浸させることで, 電界印加に応じて規則的な粘着スポットが生じ, 対象物を固定可能な電気粘着表面(EAS)の開発に成功した。片側電極構造を適用したEASは, Siウェハを電気粘着効果により保持することが可能で, 高真空環境下でも機能することを明らかにした。また, 高温環境下で印加電場に応じた保持力が高まることが実験的に示され, 真空・高温プロセスのウェハ保持機構として応用可能性が高いことを確認した。
For a fixture device of wafer in semiconductor process under vacuum and hightemperature condition, we worked on development of a functional electro-adhesive surface with micro texture in this study. By impregnating three dimensional micro-mesh structure with an adhesive elastomer, an electro-adhesive surface (EAS) regularly generating numerous adhesive spots on the surface according to applied electric field was successfully developed. From the experiment, it is clear that EAS with one-sided patterned electrodes is able to fix a Si wafer with electro-adhesive effect and works in high-vacuum environment. In addition, the performance of EAS is enhanced at high temperature up to 150 degree Celsius. These results represents high applicability of EAS to a fixture device in high-vacuum and high-temperature process.
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研究種目 : 基盤研究(A)(一般)
研究期間 : 2012～2015
課題番号 : 24246029
研究分野 : 生産工学
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